Power Solutions

ECI offers a wide range of ceramic to metal sealed power packages and substrates to meet your low thermal resistance and critical thermal dissipation applications. Ceramic packaging is available in surface mount designs as well as drop in and bolt-down versions. ECI offers a wide variety of advanced thermal material flanges to provide customers with solutions for high power density applications. The offering includes RF, Power Transistors and solutions for high power densities, high current and high voltage applications.

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Ceramic

• AIN
• BeO
• DBC

Metallization

• DBC
• Mo/Mn
• W

Metals

• Cu
• Cu/Mo
• Cu/W
• Mo

Braze

• Ag
• Cu/Ag
• Cu/Ag/In

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Direct Bond Copper

ECI offers a line of custom cost-effective Direct Bond Copper (DBC)products on Alumina and Aluminum Nitride. Direct Bond Copper is a widely acceptable and a time proven technology for demanding thermal management applications. This is due to its high thermal conductivity, high current capacity and heat dissipation of the high-purity copper on ceramic. ECI has the unique ability to braze metal gull wing leads and other configurations to DBC.

Electro Ceramic Industries Recommends Direct Bond Copper for Demanding Thermal Management Applications

Electro Ceramic Industries/ ECI offers cost effective and rapid turnaround Direct Bond Copper(DBC) products on Alumina and Aluminum Nitride. Direct Bond Copper (DBC) is a widely acceptable and a long-proven technology for power electronic products due to its high thermal conductivity, high current capacity and heat dissipation of the high-purity copper on ceramic. DBC is the direct mating of two dissimilar electronic materials (Copper and Ceramic). The interface between the pure copper and the ceramic is very reliable. The process takes advantage of the copper – oxygen eutectic where the melting point is lower than that of pure copper or oxide ceramic. At the melting temperature the eutectic is the only liquid present, it wets and bonds to both surfaces.

Utilizing various copper and ceramic thickness and ceramic type makes it is feasible to affect a resulting CTE value of total system to avoid a CTE mismatch with different semiconductor devices. The standard Direct Bond Copper or DBC technology which uses copper foil thicknesses in the range of 0.005 to 0.020inches. It is best utilized where the large geometry requirements of 0.015 inch wide lines and spacing scan be used.

Direct bond copper (DBC) substrates are comprised of a ceramic isolator, Al 2 O 3  (aluminium oxide) or AlN (aluminium nitride), onto which pure copper is bonded in a high temperature melting and diffusion process. The great heat conductivity of Al 2 O 3  (24 W/mK), AlN (180/230 W/mK) and HPS (28 W/mK), as well as the high heat capacity and heat spreading provided by the thick copper layer (200 - 600 µm),make Electro Ceramic Industries ceramic substrates irreplaceable in power electronics.

The coefficient of thermal expansion of Al 2 O 3  (7.1 ppm/K) and AlN (4.7 ppm/K) is close to that of silicon(4 ppm/K). Therefore, DBC is a suitable substrate for durable packaging of bare dice since such assemblies are not likely to fatigue during the product life.

ECI has developed a proprietary process that provides it with the unique ability to braze metal gull wing leads and other configurations to DBC. The strength of the copper bond to ceramic is subject to delamination at high temperatures and reducing atmospheres. ECI’s process does not degrade the bond and allows for more expansive designs.

ECI is your Direct Bond Copper source for all of your demanding thermal management applications. The entire ECI teams looks forward to the prospects of becoming a supplier to your organization.