ECI's Technology
Learn more about ECI's manufacturing capabilities and our materials.
Learn more about ECI's manufacturing capabilities and our materials.
Our capabilities include:
Processes include Au, Ag, Ni, Cu, Sn and Au/Sn alloy. ECI has developed plating processes to meet the high reliability requirements of our customers and the microelectronics industry. We are one of the few who plate Au/Sn as an alloy.
Refractory Metallization is offered using a proprietary formulation of Molybdenum/Manganese or Tungsten paste, patterns are screened onto the BeO, Al2O3 or AlN, and high temperature fired.
Using custom developed profiles with furnaces that utilize controlled temperature and atmosphere, ECI has a wide assortment of alloys, brazing leads, tubes and pins of needed metals to ceramic substrate configurations are standard.
With over 100 years of experience on staff, ECI can discuss your requirements, manufacture prototypes, and full production. Our staff has the technical competence to assist and make suggestions to increase manufacturing efficiency thereby saving cost to our customers.
Using highly qualified and proven vendors, ECI utilizes high precision laser processing, dicing. and photo etching to manufacture sub-components used in our assembly operations to produce high quality products.
A few of our tools we have to build and test your products.
View our technical data sheets for Direct Bond Copper, Kovar, Copper, Molybdenum, AlN, Alumina, and Beryllium Oxide to learn more about each material's physical properties and specifications.
View SheetECI has been serving customers around the globe for more than 50 years. We would love to work with and share our vast industry knowledge with you. Contact us to get started!
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