ECI's Metalized Ceramic is highly customizable to meet specific device footprint needs. The product features thick film metallized thru-hole and wraparound castellations, allowing for leadless surface mountable configurations. This adaptability makes it suitable for various applications including microwave, optoelectronic, and power packages. Metallization options include Silver (Ag), Molybdenum/Manganese (Mo/Mn), and Tungsten (W). Specialized plating processes include Gold (Au), Nickel (Ni), Gold/Tin (Au/Sn), Copper (Cu), Silver (Ag), and Tin (Sn).
Materials
- Aluminum Oxide (AL203)
- Aluminum Nitride (AIN)
- Beryllium Oxide (BeO)
Thick Film Metallization
- Molybdenum Manganese
- Tungsten
Processes
- Single Layer
- Wrap Arounds
- .010" Lines and Spaces
- Thru Hole Metallization